| Equipment for resist coating of semiconductor wafers or glass plates and the development of photoresist. | ||
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Photolithography is a technology for transferring patterns from a mask or reticle onto an substrate.
This methode is used for the manufacturing of integrated circuits ICs, but also for the production of LEDs, OLEDs
and in the MEMS technology, as well as for LCD manufacturing.
The first step is the deposition of photosensitive photo resist on the substrate, which is then dryed and cured.
Then the resist will be exposed by a mask aligner or stepper.
Using a mask or reticle the areas of the substrate are covered, which should not be illuminated.
After the exposure, the photo resist will be developed, meaning that either illuminated or non-illuminated parts of the resist are resolved.
The main process is then following, e.g. the depostion of oxide or
nitride or plasma etching of some layers.
Finally the remaining photo resist is removed in an asher.
Usually, many of such steps are necessary for the production of integrated circuits and illumination equipment like mask aligners belong
therefore to the most important pieces of equipment in the semiconductor industry.
The company of TSTI Tech in Korea is a company of the JW group and manufactures so-called track systems for cleaning and resist coating of wafers and developers for photo resist. Either positive resist or negative resist can be used. In case of positive resist, after exposure, the illuminated parts of the photo resist are removed and the remaining structure looks like the mask. When negative resist is used, then the non-illuminated material can be removed during developing and a negative picture of the mask is created. Equipment for cleaning, resist coating and resist development have quite often a similar design. TSTI can offer several types of equipment:
| Core Technology |
Manufacturing Process |
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| Spin Coater |
• Coating Uniformity • Spin Accuracy • Vibration Control |
LCD / Wafer / Mask |
| Spin Cleaner |
• Wafer Mark • Spin Accuracy • Vibration Control |
LCD / Wafer / Mask |
| Slot Coater |
• Intermittant Coating • Coating Uniformity |
LCD / OLED / E.M.I. |
| Roll Coater |
• Coating Uniformity • Dry Zone Efficiency • Particle Yield Control |
Display Window / P.C.B. |
For coating of semiconductor wafers, usually spin type coating machines are used. Spin coaters rotate the sample and dispense the resist on the rotating wafer. The centrifugal force distributes the photo resist to a homogenious layer over the sample. Overshooting amount of resist is collected by the cup shielding the rotating wafer. When necessary, a precurser can be dispensed on the wafer before spin coating the resist in order to increase adhesivity. Integrated in the machine are also hot plates for baking the resist after spin coating as well as cooling plates for increase cooling speed after heating.

Development of the photo resist is also done on a photo track system. The solvent, that removes the soft part of the resist after exposure is dispensed on the rotating wafer. Rotating the wafer will also dry up the wafer after solvent dispensing has been stopped. Gas blowing is supporting the final drying process. TSTI's tracking systems model Smart Cube II are cost effective and very reliable in combination with a high throughput. The photo track systems are available for all wafer sizes up to 300mm diameter. For laboratory use, the smaller, manuelly loaded type Smart Cube MS is available:

For resist coating of glass plates the style of spin coating can be used also. The rotors and with it the whole equipment get pretty large then. These machines can also be used for cleaning of glass plates.

Model Smart Cube L has been developed for such applications.
For very large glass plates spin type track systems reach their limits. TSTI designed a photo resist coating system for large size glasses for FPD application, using a slit nozzle on a scanning system. It reduces the amount of the chemical waste and can reach high coating speed, high precision and high performance.

The transportation of the glass plates from the cassettes to the coating module and further to hot plates and cool plates is done by a large fork robot. Vaccum can also be used for drying.
| Crystec Technology Trading GmbH will be pleased to further discuss details with you. | ||
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