Equipment for wet etching and cleaning of semiconductor or silicon wafers.
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Wet etching

Wet etching or cleaning of silicon or semiconductor wafers can be done in an immersion bath or by a spray etcher or spin-on technology. It is an alternative to plasma etching or dry etching. This technology can be used for etching oxide, nitride, silicon, other layers or to remove (strip) photoresist. In an immersion bath, the wafers will be etched in a plastic cassette which is moved in the bath in order to ensure, that the etchant is continously refreshed near the wafer surface. Sometimes megasonic technology is used in order to improve the etching effectivity. Spray etcher or spin-on etcher guarantee the permanent exchange of the etching solution and are therefore very effective and uniform. The etchant can be circulated in order to reduce material consumption. The spin-on technology allows higher flow rates and etch rates - however this technology is little bit more complex.
Wet etching is cheap and can be used easily for mass production. Etching speed and selectivity is rather high. It is however quite often isotrop, etching in all directions. Automation can be achieved without problems.
The wafers will be etched sour or caustic, then purged with de-ionized water and finally dryed. For drying several methods can be used: displacement of water by solvents, spin-drying, gas purging, heating or combination. Popular is the Marangoni drying technology, using Isopropanol in order to replace the water in combination with gas drying by hot nitrogen. This page gives you an overview and comparison about available equipment and technology.

Equipment for wet etching and cleaning of semiconductor wafers.

For etching semiconductor layers, cleaning of semiconductor wafers and for removing photo resist, several types of equipment can be used. In high throughput equipment, wafers are processed in cassettes. Single wafer treatment results in higher performance, but is little bit slower. Available are machines for immersion etching, spray etching and spin-on etching. The etching and cleaning effect can be improved by mechanic action, using brushes. The range of equipment includes also systems for wafer drying, integrated or stand alone versions.

Various Zeus/JET equipment for wet etching

Single wafer systems can combine several processing units, loaded by a robot from cassette I/O stations. Batch etching systems can be designed for real high throughput and automatic bath to bath transportation.

      
Examples for the configuration of Zeus/Jet wet etch equipment

Wet etching of Czochralski silicon crystals and poly-crystalline silicon blocks for semiconductor and solar wafer manufacturing.

Wet etching equipment from can be configured also for etching Czochralski crystals or molded poly-silicon blocks for solar wafer production. Etching reduces in this case metallic contamination of the silicon. The process can be run fully automatic.

We can configure a system for you, that fulfills all your expectations.

Crystec Technology Trading GmbH will be pleased to further discuss details with you.
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