Mask aligner pour l'industry semiconducteur
	Neutronix-Quintel est représentée en Europe* par Crystec Technology Trading GmbH
	English   deutsch   français Société   Lithographie   Mask aligner   LED   MEMS

Mask aligner pour l'industry semiconducteur

Once reserved solely for building integrated circuits, contact mask aligners are being updated to fabricate products in diverse industries such as biotechnology, consumer electronics, aerospace, communications, and transportation. Canon PLA and MPA series machines survive as extremely capable production machines - so much so that they still represent a very capable starting point in this migration to new markets. In the hands of competent re-manufacturers like Neutronix, these machines are even enjoying a "second wind" of utility.
New-generation contact mask aligners handle new sizes of substrates, ranging from pieces up to eight inches in diameter, which can help reduce production expenses when cost-cutting is necessary. These newer machines can also be adapted to handle different substrate shapes, such as squares and rectangles, which were never even imagined at the time when contact mask aligner technology was originated 25-plus years ago.
Particularly in R&D applications, the need to go beyond traditional quartz or glass plate photo masks has accelerated. When one-off prototyping is a top priority, newer mask aligners make excellent economic sense because they can handle thin film mylar masks - patterns can be generated and printed onto a mylar mask using nothing more than a high-quality laser printer.
When a company moves beyond the R&D and prototyping stage into manufacturing large production quantities, moving up to a high-capacity contact mask aligner makes perfect sense. Here, the new-generation machines excel by offering features such as simple topside mask loading, robotic autoload handling, and auto-alignment.
Some tools offer the best of both worlds, initially featuring manual-tray loading, with the ability to simply add a module to switch over to high-capacity loading processes when need dictates. Because of the open architecture now employed within some new-generation contact mask aligners, manufacturers now have a wide variety of choices in customizing an aligner when unique fabricating requirements materialize.
Far from the least of considerations, economic realities often dictate when new production equipment gets purchased. In such instances, contact mask aligner technology promises the best benefit-to-cost ratio. New-generation contact aligners can reproduce traces as small as 0.5 microns at a fraction of the price of expensive stepper technology. In addition, the latest contact aligners give away little, if anything, in terms of flexibility to any other tools.
Just as important - precisely because contact proximity alignment technology has existed for so long - the latest generation of tools benefits from years of refinement to the point that they are extremely reliable and robust while still offering low overhead costs. As ongoing support contracts become less of a necessity, users can lower the cost of ownership even further.

Crystec Technology Trading GmbH, Germany, www.crystec.com, +49 8671 882173, FAX 882177

NXQ8000 R&D and Production Mask Aligner Multiple contact & proximity exposure modes Wafer size from pieces to 200 mm diameter Square substrate up to 6" x 6" Optical and CCTV splitfield microscope options Simple topside mask loading Manual tray loading feature Modular design, easily configurable for wide variety of applications with available options: Robotic autoload handling Automatic alignment Optical (OBS) and Infrared (IR) backside alignment Large gap alignment UV / NUV / DUV Exposure optics

Crystec Technology Trading GmbH, Germany, www.crystec.com, +49 8671 882173, FAX 882177

NXQ 4004 R&D and Production Contact Mask Substrate size from pieces to 100 mm diameter Manual X, Y and theta alignment stage Vacuum / Pressure Contact Exposure Modes Manual trayloading feature Splitfield / Singlefield optical microscope Simple, topside mask loading User friendly Low maintenance Available Options: Infrared (IR) back side alignment UV / NUV exposure optics Carousel loading CCTV Viewing

NXQ 4006 R&D and Production Contact Mask Substrate size from pieces to 150 mm diameter Manual X, Y and theta alignment stage Vacuum / Pressure contact exposure modes Optical Splitfield and CCTV microscope options Simple, topside mask loading Low maintenance Available Options: Infrared (IR) back side alignment Large gap alignment UV / NUV / DUV exposure optics Carousel load

Crystec Technology Trading GmbH, Germany, www.crystec.com, +49 8671 882173, FAX 882177

Refurbished Canon PLA Mask Aligners PLA 501/600 FEATURES Contact/Proximity Alignment - 60-100 WPH Infrared Backside Alignment Dual Channel Light Integration or C.I. (constant intensity) Fiber Optic Illumination High Resolution Video NEUTRONIX combines the expertise of component manufacturing and complete systems knowledge in providing you with the highest quality remanufactured equipment available. Wafer Sizes: 2" to 6" Semi Spec, Pieces, Squares Wafer Feed: Manual and/or Cassette to Cassette Auto Feeder Alignment: Manual / Automatic UV Power: 250, 350, 500 Watts, 1 and 2 kW UV Spectrum: deep UV, near deep UV, near UV Resolution: less than .5µm in hard contact

Refurbished Canon MPA Projection Mask Aligners MPA 600 FEATURES Projection Alignment - 72 WPH Temperature Control Thermal/Pneumatic Distortion Control 1X Scanning Mask Changer (Optional) NEUTRONIX combines the expertise of component manufacturing and complete systems knowledge in providing you with the highest quality remanufactured equipment available. Wafer Sizes: 3" to 6" Semi Spec Wafer Feed: Dual Cassette, Auto Feeder Alignment: Manual / Automatic Resolution: 1.5µm CD with Depth-Of-Focus ±6µm

Crystec Technology Trading GmbH est à votre disposition pour vous aider dans la réalisation de vos projets.
Table des Matières	Pour obtenir des informations supplémentaires n'hésitez pas à nous contacter.	Début de page