|Equipment for resist coating of semiconductor wafers or glass plates and the development of photoresist.|
Crystec Technology Trading GmbH
Company Resist Etch Si3N4 Solar PV module Module factory
Photolithography is a technology for transferring patterns from a mask or reticle onto an substrate.
This methode is used for the manufacturing of integrated circuits ICs, but also for the production of LEDs, OLEDs
and in MEMS technology, as well as for LCD manufacturing.
The first step is the deposition of photosensitive photo resist on the substrate, which is then dryed and cured. Then the resist will be exposed by a mask aligner or stepper. Using a mask or reticle the areas of the substrate are covered, which should not be illuminated. After the exposure, the photo resist will be developed, meaning that either illuminated or non-illuminated parts of the resist are removed. The main process is then following, e.g. the depostion of oxide or nitride or plasma etching of some layers. Finally the remaining photo resist is removed in an asher and/or a liquid chemical. Usually, many of these steps are necessary for the production of integrated circuits. Therefore illumination equipment, like mask aligners, is among the most important pieces of equipment in the semiconductor industry.
The Korean company ZEUS Co., Ltd. manufacture a variety of systems for etching, cleaning, resist coating of wafers and developing photo resist. Either positive resist or negative resist can be used. In case of positive resist, after exposure, the illuminated parts of the photo resist are removed and the remaining structure looks like the mask. When negative resist is used, then the non-illuminated material can be removed during developing and a negative picture of the mask is created. Equipment for cleaning, resist coating and resist development is quite often similar in design.
For coating of semiconductor wafers, usually spin type coating machines are used. Spin coaters rotate the sample and dispense the resist on the rotating wafer. The centrifugal force distributes the photo resist to a homogenious layer over the sample. Overshooting amount of resist is collected by the cup shielding the rotating wafer. When necessary, a precurser can be dispensed on the wafer before spin coating the resist in order to increase adhesivity. Integrated in the machine are also hot plates for baking the resist after spin coating as well as cooling plates for increase cooling speed after heating.
Development of the photo resist is also done on a single wafer spin system. The solvent, that removes the soft part of the resist after exposure is dispensed on the rotating wafer. Rotating the wafer will also dry up the wafer after solvent dispensing has been stopped.A gas blow is supported the final drying process. ZEUS' SSD spin systems are cost effective and very reliable in combination with a high throughput. They are available for wafer sizes up to 300mm diameter. For laboratory use, a smaller, manuelly loaded type is available. The resist stripping can be done with spin tool from the same family of machines.
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